Datasheet
P
D
+ (V
IN
* V
OUT
) I
OUT
TPS732xx
www.ti.com
SBVS037O –AUGUST 2003–REVISED AUGUST 2010
POWER DISSIPATION Power dissipation depends on input voltage and load
conditions. Power dissipation (P
D
) is equal to the
The ability to remove heat from the die is different for
product of the output current times the voltage drop
each package type, presenting different
across the output pass element (V
IN
to V
OUT
):
considerations in the PCB layout. The PCB area
around the device that is free of other components (6)
moves the heat from the device to the ambient air.
Power dissipation can be minimized by using the
Performance data for JEDEC low- and high-K boards
lowest possible input voltage necessary to assure the
are shown in the Power Dissipation Ratings table.
required output voltage.
Using heavier copper will increase the effectiveness
in removing heat from the device. The addition of
PACKAGE MOUNTING
plated through-holes to heat-dissipating layers will
also improve the heat-sink effectiveness.
Solder pad footprint recommendations for the
TPS732xx are presented in Application Bulletin
Solder Pad Recommendations for Surface-Mount
Devices (SBFA015), available from the Texas
Instruments web site at www.ti.com.
space
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision N (August, 2009) to Revision O Page
• Replaced the Dissipation Ratings table with the Thermal Information table ........................................................................ 3
Changes from Revision M (May, 2008) to Revision N Page
• Changed Figure 12 ............................................................................................................................................................... 8
• Added paragraph about recommended start-up sequence to Internal Current Limit section ............................................. 13
• Added paragraph about current foldback and device start-up to Enable Pin and Shutdown section ................................ 13
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