Datasheet
P
D
+ (V
IN
* V
OUT
) I
OUT
TPS731xx
SBVS034M –SEPTEMBER 2003–REVISED AUGUST 2009..........................................................................................................................................
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POWER DISSIPATION
(6)
The ability to remove heat from the die is different for
Power dissipation can be minimized by using the
each package type, presenting different
lowest possible input voltage necessary to assure the
considerations in the PCB layout. The PCB area
required output voltage.
around the device that is free of other components
moves the heat from the device to the ambient air.
PACKAGE MOUNTING
Performance data for JEDEC low- and high-K boards
Solder pad footprint recommendations for the
are shown in the Power Dissipation Ratings table.
TPS731xx are presented in Application Bulletin
Using heavier copper will increase the effectiveness
Solder Pad Recommendations for Surface-Mount
in removing heat from the device. The addition of
Devices (SBFA015), available from the Texas
plated through-holes to heat-dissipating layers also
Instruments web site at www.ti.com.
improves the heat-sink effectiveness.
Power dissipation depends on input voltage and load
conditions. Power dissipation (P
D
) is equal to the
product of the output current times the voltage drop
across the output pass element (V
IN
to V
OUT
):
space
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision L (May, 2009) to Revision M ..................................................................................................... Page
• Changed Figure 12 ............................................................................................................................................................... 7
• Added paragraph about recommended start-up sequence to Internal Current Limit section ............................................. 12
• Added paragraph about current foldback and device start-up to Enable Pin and Shutdown section ................................ 12
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