Datasheet

TPS72710 , TPS72711 , TPS72715 , TPS727185 , TPS72718 , TPS72719 , TPS72725
TPS72727 , TPS727285 , TPS72728 , TPS72730 , TPS72733 , TPS72748 , TPS72750
SBVS128D –JUNE 2009–REVISED FEBRUARY 2014 www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
(1)
At T
J
= –40°C to +125°C (unless otherwise noted). All voltages are with respect to GND.
PARAMETER TPS727xx UNIT
Input voltage range, V
IN
–0.3 to +6.0 V
Enable voltage range, V
EN
–0.3 to +6.0
(2)
V
Output voltage range, V
OUT
–0.3 to +6.0 V
Maximum output current, I
OUT
Internally limited
Output short-circuit duration Indefinite
Operating junction temperature range, T
J
–55 to +150 °C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) V
EN
absolute maximum rating is V
IN
or 6.0V, whichever is less.
6.2 Handling Ratings
MIN MAX UNIT
T
stg
Storage temperature range –55 +150 °C
V
ESD
(1)
Human Body Model (HBM) ESD stress voltage
(2)
2 kV
Charged Device Model (CDM) ESD stress voltage
(3)
500 V
(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in
to the device.
(2) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows
safe manufacturing with a standard ESD control process.
(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe
manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
Over operating junction temperature range (unless otherwise noted).
MIN NOM MAX UNIT
V
IN
Input voltage 2 5.5 V
I
OUT
Output current 0 250 mA
T
J
Operating junction temperature range –40 +125 °C
6.4 Thermal Information
TPS727xx
THERMAL METRIC
(1)
DSE YFF UNITS
6 TERMINALS 4 TERMINALS
θ
JA
Junction-to-ambient thermal resistance 190.5 160
θ
JCtop
Junction-to-case (top) thermal resistance 94.9 75
θ
JB
Junction-to-board thermal resistance 149.3 76
°C/W
ψ
JT
Junction-to-top characterization parameter 6.4 3
ψ
JB
Junction-to-board characterization parameter 152.8 74
θ
JCbot
Junction-to-case (bottom) thermal resistance
(2)
N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) θ
JCbot
not applicable because there is no thermal pad.
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TPS727285 TPS72728 TPS72730 TPS72733 TPS72748 TPS72750