Datasheet

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EXAMPLE BOARD LAYOUT
4X 0.23 0.02
(0.4) TYP
(0.4) TYP
(
)
METAL
0.23
0.05 MAX
SOLDER MASK
OPENING
METAL
UNDER
MASK
(
)
SOLDER MASK
OPENING
0.23
0.05 MIN
02/2014
DSBGA - 0.625 mm max heightYFF0004
DIE SIZE BALL GRID ARRAY
NOTES: (continued)
4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
Refer to Texas Instruments Literature No. SBVA017 (www.ti.com/lit/sbva017).
SOLDER MASK DETAILS
NOT TO SCALE
TPS727xxYFF
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:50X
1
2
A
B
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED