Datasheet

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PACKAGE OUTLINE
C
0.625 MAX
0.30
0.12
0.4
TYP
0.4 TYP
4X
0.3
0.2
B E
A
D
02/2014
DSBGA - 0.625 mm max heightYFF0004
DIE SIZE BALL GRID ARRAY
D: Max = 0.82 mm, Min = 0.76 mm
E: Max = 1.19 mm, Min = 1.13 mm
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. NanoFree
TM
package configuration.
NanoFree Is a trademark of Texas Instruments.
TPS727xxYFF
BALL A1
CORNER
SEATING PLANE
BALL TYP
B
A
1
2
0.015 C A B
SYMM
SYMM
SCALE 13.000