Datasheet

P =(V V ) I-
D IN OUT OUT
´
TPS72710 , TPS72711 , TPS72715 , TPS727185 , TPS72718 , TPS72719 , TPS72725
TPS72727 , TPS727285 , TPS72728 , TPS72730 , TPS72733 , TPS72748 , TPS72750
www.ti.com SBVS128D –JUNE 2009–REVISED FEBRUARY 2014
8.3 Do's and Don'ts
Do place at least one 1.0-µF ceramic capacitor as close as possible to the OUT terminal of the regulator.
Do not place the output capacitor more than 10 mm away from the regulator.
For DSE devices, do tie the NC terminals to ground to improve thermal dissipation.
Do connect a 0.1-μF to 1.0- μF low equivalent series resistance (ESR) capacitor across the IN terminal and GND
input of the regulator.
Do not exceed the absolute maximum ratings.
9 Power Supply Recommendations
These devices are designed to operate from an input voltage supply range between 2.0 V and 5.5 V. The input
voltage range should provide adequate headroom in order for the device to have a regulated output. This input
supply should be well regulated. If the input supply is noisy, additional input capacitors with low ESR can help
improve the output noise performance.
10 Layout
10.1 Layout Guidelines
10.1.1 Board Layout Recommendations To Improve PSRR And Noise Performance
To improve ac performance such as PSRR, output noise, and transient response, it is recommended that the
board be designed with separate ground planes for V
IN
and V
OUT
, with the ground plane connected only at the
GND terminal of the device. In addition, the ground connection for the output capacitor should connect directly to
the GND terminal of the device. High ESR capacitors may degrade PSRR.
10.1.2 Power Dissipation
The ability to remove heat from the die is different for each package type, presenting different considerations in
the printed circuit board (PCB) layout. The PCB area around the device that is free of other components moves
the heat from the device to the ambient air. Performance data for JEDEC low- and high-K boards are given in the
Thermal Information table. Using heavier copper increases the effectiveness in removing heat from the device.
The addition of plated through-holes to heat-dissipating layers also improves the heatsink effectiveness.
Power dissipation depends on input voltage and load conditions. Power dissipation (P
D
) is equal to the product of
the output current times the voltage drop across the output pass element (V
IN
to V
OUT
), as shown in Equation 3:
(3)
10.1.3 Package Mounting
Solder pad footprint recommendations and recommended land patterns are attached to the end of this data
sheet.
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