Datasheet

0
100
120
140
160
180
PCB Copper Area − in
2
− Thermal Resistance −
θJA
R C/W
°
No Air Flow
80
60
40
20
0.1 1 10
0
1
2
3
6
0 25 50 75 100 150
− Maximum Power Dissipation − W
P
D
125
T
A
= 25°C
T
A
− Ambient Temperature − °C
4
5
4 in
2
PCB Area
0.5 in
2
PCB Area
TPS72501
TPS72515, TPS72516
TPS72518, TPS72525
www.ti.com SLVS341E –MAY 2002–REVISED JUNE 2010
Figure 24. SOT223 Thermal Resistance vs PCB AREA
From the data in Figure 24 and rearranging Equation 6, the maximum power dissipation for a different ground
plane area and a specific ambient temperature can be computed (as shown in Figure 25).
Figure 25. SOT223 Power Dissipation
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