Datasheet

TPS7101Q, TPS7133Q, TPS7148Q, TPS7150Q
TPS7101Y, TPS7133Y, TPS7148Y, TPS7150Y
LOW-DROPOUT VOLTAGE REGULATORS
SLVS092G – NOVEMBER 1994 – REVISED JANUARY 2003
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
†
TPS7133, TPS7148, TPS7150 (fixed-voltage options)
‡
Capacitor selection is nontrivial. See application information section
for details.
SENSE
PG
OUT
OUT
9
8
6
10
IN
IN
IN
EN
GND
321
20
15
14
13
V
I
0.1 µF
PG
CSR
V
O
10 µF
+
TPS71xx
†
C
O
‡
Figure 2. Typical Application Configuration
TPS71xx chip information
These chips, when properly assembled, display characteristics similar to the TPS71xxQ. Thermal compression
or ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with
conductive epoxy or a gold-silicon preform.
(6)
(4)
(3)
(7)
(2)
(1)
GND
FB
¶
OUT
PG
IN
EN
TPS71xx
80
92
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
(6)
(7)
(2)
(5)
(4)
(3)
(1)
§
SENSE – Fixed voltage options only (TPS7133, TPS7148,
and TPS7150)
¶
FB – Adjustable version only (TPS7101)
BONDING PAD ASSIGNMENTS
SENSE
§
(5)
NOTE A: For most applications, OUT and SENSE should
be tied together as close as possible to the device;
for other implementations, refer to SENSE-pin
connection discussion in the Applications
Information section of this data sheet.