Datasheet

TPS71025
LOW-DROPOUT VOLTAGE REGULATOR
SLVS162A – MAY 1997 – REVISED MAY 1998
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Terminal Functions
TERMINAL
NAME
NO.
DESCRIPTION
NAME
D or P PW
EN 2 6 Enable input. Logic low enables output
GND 1 1–3 Ground
IN 3, 4 8–10 Input supply voltage
OUT 5, 6 13, 14 Output voltage
SENSE 7 15 Output voltage sense input
TPS71025Y chip information
These chips, when properly assembled, display characteristics similar to those of the TPS71025. Thermal
compression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be
mounted with conductive epoxy or a gold-silicon preform.
(4)
(3)
(2)
(1)
GND
OUT
IN
EN
TPS71025
80
92
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
(2)
(5)
(4)
(3)
(1)
BONDING PAD ASSIGNMENTS
SENSE
(5)
NOTE A: For most applications, OUT and SENSE should
be tied together as close as possible to the device;
for other implementations, refer to SENSE-pin
connection discussion in the Application
Information section of this data sheet.