Datasheet
TPS709
SBVS186E –MARCH 2012–REVISED NOVEMBER 2013
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REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (October 2013) to Revision E Page
• Changed DRV (SON-6) package status from Preview to Production Data .......................................................................... 1
• Deleted SON-6 package from footnote 1 in Features section .............................................................................................. 1
• Deleted DRV package from pin out diagram note ................................................................................................................ 1
• Deleted DRV from pin out note in the Pin Configurations section ........................................................................................ 4
Changes from Revision C (June 2013) to Revision D Page
• Changed device status from Production Data to Mixed Status ............................................................................................ 1
• Changed last Features bullet: added footnote and changed device order ........................................................................... 1
• Added note to pin out diagrams ............................................................................................................................................ 1
• Added product preview footnote to pin configurations .......................................................................................................... 4
Changes from Revision B (November 2012) to Revision C Page
• Changed title ......................................................................................................................................................................... 1
• Added DCY (SOT-223) and DRV (SON) packages to data sheet ....................................................................................... 1
• Changed I
Q
feature bullet value from 1.35 µA to 1 µA ......................................................................................................... 1
• Added typical application circuit ............................................................................................................................................ 1
• Changed quiescent current value in first paragraph of Description section from 1.35 µA to 1 µA ....................................... 1
• Changed text in second paragraph of Description section from "leakage" to "shutdown." .................................................. 1
• Added DRV and DCY packages to Thermal Information table ............................................................................................ 2
• Changed ground pin current typical values for I
OUT
= 0-mA test conditions ......................................................................... 3
• Added DCY and DRV packages to Pin Configuration section ............................................................................................. 4
• Added DCY and DRV packages to Pin Descriptions table ................................................................................................... 4
Changes from Revision A (October 2012) to Revision B Page
• Changed Line regulation and Load regulation parameters in Electrical Characteristics table ............................................. 3
• Changed I
GND
parameter test conditions in Electrical Characteristics table ......................................................................... 3
• Changed I
SHUTDOWN
parameter test conditions in Electrical Characteristics table ................................................................ 3
• Changed footnote 4 in Electrical Characteristics table ......................................................................................................... 3
• Added Pin Configuration section .......................................................................................................................................... 4
• Changed second paragraph of Dropout Voltage section .................................................................................................... 12
Changes from Original (March 2012) to Revision A Page
• Changed device status from Product Preview to Production Data ....................................................................................... 1
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