Datasheet
SLVS141A − JULY 1996 − REVISED JANUARY 1997
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
chip information
These chips, when properly assembled, display characteristics similar to the TPS6735. Thermal compression
or ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with
conductive epoxy or a gold-silicon preform.
75
82
8881
2
3
455
TPS6735Y
(1)
(2)
(3)
(8)
(7)
(6)
EN
REF
SS
OUT
FB
V
CC
GND
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
6
7
7
(4)
(5)
COMP
Terminal Functions
TERMINAL
DESCRIPTION
NAME NO.
DESCRIPTION
EN 1 Enable. EN > 2 V turns on the TPS6735. EN ≤ 0.4 V turns it off.
REF 2 1.22-V reference voltage output. REF can source 125 µA for external loads.
SS 3 Soft start. A capacitor between SS and GND brings the output voltage up slowly.
COMP 4 Compensation. A capacitor to ground stabilizes the feedback loop.
FB 5 Feedback. FB connects to the dc/dc converter output.
GND 6 Ground
OUT 7 Power MOSFET drain connection
V
CC
8 Supply-voltage input