Datasheet

TPS6734I
FIXED 12-V 120-mA BOOST-CONVERTER SUPPLY
SLVS127A – AUGUST 1995 – REVISED JANUARY 1999
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
AVAILABLE OPTIONS
PACKAGE
T
A
SMALL OUTLINE
(D)
PLASTIC DIP
(P)
–40°C to 85°C TPS6734ID TPS6734IP
The D package is available taped and reeled. Add the suffix R
to the device type (e.g., TPS6734IDR).
TPS6734 chip information
Thermal compression or ultrasonic bonding can be used on the doped-aluminum bonding pad. Chips can be
mounted with conductive epoxy or a gold-silicon preform. Contact factory for die sales.
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4X4 MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%
ALL DIMENSIONS ARE IN MILS.
BONDING PAD ASSIGNMENTS
4
3
5
5
6
7
7
8
2
1
(1)
(2)
(3)
(4)
(5)
(5)
(6)
(7)
(7)
92
75
(8)
V
CC
FB
OUT
GND
EN
REF
SS
COMP
1
2
3
4
8
7
6
5
TPS6734