Datasheet

DIG.MIC.CLK0/1
DIG.MIC.0/1
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hold
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032-036
TPS65950
www.ti.com SWCS032E–OCTOBER 2008–REVISED JANUARY 2011
Figure 6-23 is a timing diagram of the digital microphone bias module.
Figure 6-23. Digital Microphone Bias Module Timing Diagram
6.2.1.4 Silicon Microphone Characteristics
Based on silicon micro-electrical-mechanical system (MEMS) technology, the new microphone achieves
the same acoustic and electrical properties as conventional microphones, but is more rugged and exhibits
higher heat resistance. These properties offer designers greater flexibility and new opportunities to
integrate microphones.
The silicon microphone is the integration of mechanical elements and electronics on a common silicon
substrate through microfabrication technology.
The complementary metal oxide semiconductor (CMOS) MEMS microphone is more like an analog IC
than a classic electric condenser microphone (ECM). It is powered as an IC with a direct connection to the
power supply. The on-chip isolation between the power input and the rest of the system adds power
supply rejection (PSR) to the component, making the CMOS MEMS microphone inherently more immune
to power supply noise than an ECM and eliminating the need for additional filtering circuitry to keep the
power supply line clean.
Figure 6-24 is a schematic of the silicon microphone module.
Copyright © 2008–2011, Texas Instruments Incorporated Audio/Voice Module 89
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