Datasheet

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032-001
TPS65950
SWCS032E–OCTOBER 2008–REVISED JANUARY 2011 www.ti.com
16 TPS65950 Package
16.1 TPS65950 Standard Package Symbols
Table 15-1 shows the TPS65950 printed device reference.
Figure 16-1. Printed Device Reference
Table 16-1 lists the symbols used in the TPS65950 nomenclature.
Table 16-1. TPS65950 Nomenclature Description
Field Meaning
P Prototype (X), preproduction (P), or qualified/production device (blank)
(1)
A Mask set version descriptor (initial silicon = blank, first silicon revision = A, second silicon revision = B,...)
(2)
YM Year month
LLLLS Lot code
$ Fab planning code
(1) A blank in the symbol or part number is collapsed so there are no gaps between characters.
(2) Initial silicon version is ES1.0; first revision can be named ES2.0, ES1.1 or ES1.01, depending on the level of change.
Note: Device name is a maximum of 10 characters.
16.2 Package Thermal Resistance Characteristics
Table 16-2 lists the thermal resistance characteristics for the recommended package types used for the
TPS65950.
Table 16-2. TPS65950 Thermal Resistance Characteristics
Package R
θJA
(°C/W) R
θJB
(°C/W) R
θJC
(°C/W) Board Type
TPS65950 38.4 15.2 19.2
(1)
1S2P
(2)
TPS65950 56.5 15.5 19.2
(1)
1S0P
(2)
(1) Not applicable. Because the POP package has a memory package on top, no heat sink can be used.
(2) The board types are defined by JEDEC (reference JEDEC standard JESD51-9, Test Board for Area
Array Surface Mount Package Thermal Measurements).
160 TPS65950 Package Copyright © 2008–2011, Texas Instruments Incorporated
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