Datasheet
o
YMLLLLS$
Pin1indicator
037-028
TPS65930/TPS65920
www.ti.com
SWCS037G–MAY 2008–REVISED APRIL 2011
15 TPS65920/TPS65930 Package
15.1 TPS65920/TPS65930 Standard Package Symbols
Figure 15-1 shows the printed device reference.
Figure 15-1. Printed Device Reference
Table 15-1 lists the fields and their meanings.
Table 15-1. TPS65920/TPS65930 Nomenclature Description
Field Meaning
P Marking used to note prototype (X), preproduction (P), or qualified/production device (blank)
(1)
A Mask set version descriptor (initial silicon = BLANK, first silicon revision = A, second silicon revision = B,...)
(2)
YM Year month
LLLLS Lot code
$ Fab planning code
(1) A blank in the symbol or part number is collapsed so there are no gaps between characters.
(2) Initial silicon version is ES1.0; first revision can be named ES2.0, ES1.1, or ES1.01, depending on the level of change.
Note: The device name is a maximum of 10 characters.
15.2 Package Thermal Resistance Characteristics
Table 15-2 and Table 15-3 list the thermal resistance characteristics for the TPS65920 and TPS65930
devices, respectively.
Table 15-2. TPS65920 Thermal Resistance Characteristics
R
θJA
(°C/W) R
θJB
(°C/W) R
θJC
(°C/W) Board Type
33.40 13.80 6.74
(1)
2S2P
(2)
57.04 14.50 6.74
(1)
1S0P
(2)
(1) This measurement is not affected by the board on which the device is mounted.
(2) The board types are defined by JEDEC (reference JEDEC standard JESD51-9, Test Board for Area
Array Surface Mount Package Thermal Measurements).
Table 15-3. TPS65930 Thermal Resistance Characteristics
R
θJA
(°C/W) R
θJB
(°C/W) R
θJC
(°C/W) Board Type
33.42 13.81 6.74
(1)
2S2P
(2)
57.05 14.51 6.74
(1)
1S0P
(2)
(1) This measurement is not affected by the board on which the device is mounted.
(2) The board types are defined by JEDEC (reference JEDEC standard JESD51-9, Test Board for Area
Array Surface Mount Package Thermal Measurements).
Copyright © 2008–2011, Texas Instruments Incorporated TPS65920/TPS65930 Package 107
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