Datasheet

TPS659110, TPS659112, TPS659113, TPS659116
www.ti.com SWCS049L –JUNE 2010–REVISED MARCH 2014
10 PCB Layout
The package ballout of the TPS65911 supports the use of inexpensive 4-layer, non-HID board technology.
Figure 22 shows an example layout.
Regardless of the chosen board technology, special care must be taken when designing the board layout for the
TPS65911 to ensure performance. For detailed guidelines, see TPS65911 Layout Guidelines, TI Literature
number SWCU080.
Figure 22. TPS65911 EVM Top Copper with Component Placement
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Product Folder Links: TPS659110 TPS659112 TPS659113 TPS659116