Using the TPS65910 EVM, A Multichannel Power-management IC, 3 Buck, 1 Boost, and 8 LDOs User's Guide Literature Number: SWCU065F March 2010 – Revised April 2013
User's Guide SWCU065F – March 2010 – Revised April 2013 Introduction 1 Description Device Description: The TPS65910 device is an integrated power-management IC available in 48-QFN package and is dedicated to applications powered by one Li-Ion or Li-Ion polymer battery cell, 3-series Ni-MH cells, or a 5 V input, and which requires multiple power rails.
TPS65910 EVM Power Capabilities www.ti.com 1.
Schematic www.ti.com + Figure 1.
Connector and Test Point Descriptions www.ti.com 4 Connector and Test Point Descriptions 4.1 Connector Descriptions 4.1.1 Boot Pins J16 and J17 are used to select the boot pin configuration for proper booting of the device. Table 2 shows the possible boot options. Table 2. Boot Configuration 4.1.2 BOOT 0 BOOT 1 POWER UP OPTION 0 0 AM35xx 0 1 EEPROM boot mode 1 0 OMAP3x 1 1 Test mode only Backup Battery J6 is used for the backup battery connection.
Connector and Test Point Descriptions www.ti.com For correct functioning of VDD3, first VAUX33 must be enabled at 3.3V and then VDD3 should be enabled using the appropriate register settings. 4.1.5 I2C connector TPS65910 has two slave I2C interfaces: one is a general-purpose interface to control the internal configuration registers, the second is dedicated to SmartReflex applications such as dynamic voltage frequency scaling (DVFS) or adaptive voltage scaling (AVS).
Test Set Up www.ti.com Table 9. Control Signals (continued) J20 PWRHOLD If PWRHOLD is low then the device will not power-up. So, connect this to HI side of the jumper. See important description below. J13 SDASR_EN2 J14 SCLSR_EN1 Both these signals can be used to control the LDO and SMPS power supplies. Please refer details on programming the internal register to achieve this function.
Test Set Up • • • • 8 www.ti.
GUI Information www.ti.com 6 GUI Information The GUI accompanying this device is fairly simple. It runs on a Windows PC. Ensure that your machine supports Microsoft .NET Framework 3.5. 6.1 Installation Instructions: To install the GUI follow these steps: 1. Download from site/Insert CD (based on how we package the GUI). 2. Create a new folder or unzip into any appropriate windows folder. If it is an exe, then select the location. The default is C:/xyz/. 6.
GUI Information www.ti.com Figure 2.
GUI Information www.ti.com Figure 3. Single Register Instance 6.3.2 Register Map Figure 4 shows the register map view. The Register Map tab provides an alternative way to access the device registers. Also in this view, the bits and complete words can be read or written through the I2C bus.
GUI Information www.ti.com Figure 4. Register Map View 6.3.3 Modes This section is used for executing multiple register writes in a single step. For example, to configure the device in SLEEP state, multiple bits must be configured for SMPS and LDO supplies. An example is provided in the .xml file that comes with the GUI package. Users can create their own sequences in the .xml file. 6.3.4 I/O writes Three control signals for the TPS65910 (SLEEP, PWRHOLD and GPIO) can be altered using the GUI.
EVM Assembly Drawings and Layout www.ti.com 7 EVM Assembly Drawings and Layout The following figures show the design of the TPS65910 EVM printed circuit board. The EVM has been designed using a 4-layer, 2-ounce, 4-inch × 4-inch copper-clad circuit board with all components on the top side and all active traces to the top to let the user easily view, probe, and evaluate the TPS65910 IC. 4.000 IN [101.
EVM Assembly Drawings and Layout www.ti.com SWCU065-006 Figure 6.
EVM Assembly Drawings and Layout www.ti.com SWCU065-007 Figure 7.
EVM Assembly Drawings and Layout www.ti.com SWCU065-008 Figure 8.
EVM Assembly Drawings and Layout www.ti.com SWCU065-009 Figure 9.
List of Materials 8 www.ti.com List of Materials Table 11 lists the EVM components as configured according to the schematic shown in Figure 1. Table 11. TPS65910 EVM Bill of Materials COUNT VALUE DESCRIPTION SIZE PART NUMBER MFR AK EECEN0F204AK Panasonic 1 C1 0.2 F Capacitor, Electric Double Layer 1 C11 0.10 µF Capacitor, Ceramic, 10 V, X5R, 10% 0402 STD {MFR} 9 C14, C15, C16, C17, C18, C19, C20, C21, C22 2.2 µF Capacitor, Ceramic, 6.
List of Materials www.ti.com Table 11. TPS65910 EVM Bill of Materials (continued) COUNT REFDES VALUE DESCRIPTION 7 TP1, TP2, TP3, TP4, TP5, TP6, TP7 PEC01SAAN Through Hole, 0.040 Diameter 1 U1 TPS65910RSL IC, Integrated Power Management 1 Y1 32.768 kHz Crystal SIZE PART NUMBER MFR PEC01SAAN Sullins QFN TPS65910RSL TI 1.50 x 3.20 mm FC-135 Epson Toyocom NOTE: These assemblies are ESD sensitive, ESD precautions must be observed.
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