Datasheet

TPS65735
SLVSAI6–JUNE 2011 www.ti.com
1.3 Pin Descriptions
Table 1-1. Pin Descriptions
PIN NAME I/O PIN NO. DESCRIPTION
POWER MANAGEMENT CORE (PMIC)
VIN I 20 AC or USB Adapter Input
ISET I/O 15 Fast-Charge Current Setting Resistor
Pin for 10 kΩ NTC Thermistor Connection
TS I 16
FLOAT IF THERMISTOR / TS FUNCTION IS NOT USED
Open-drain Output, Charge Status Indication
nCHG_STAT O 29
CONNECT TO GROUND IF FUNCTION IS NOT USED
BAT I/O 18 Charger Power Stage Output and Battery Voltage Sense Input
SYS O 19 Output Terminal to System
VLDO O 21 LDO Output
VLDO_SET I 22 Sets LDO Output Voltage (see Table 2-2)
SWITCH I 25 Switch Input for Device Power On/Off
SW_SEL I 26 Selects Type of Switch Connected to SWITCH Pin (see Table 2-6)
BST_SW O 11 Boost Switch Node
BST_FB I 13 Boost Feedback Node
BST_OUT O 10 Boost Output
HBR1 I 8 H-Bridge Input 1 for Right LC Shutter
HBR2 I 9 H-Bridge Input 2 for Right LC Shutter
HBL1 I 32 H-Bridge Input 1 for Left LC Shutter
HBL2 I 7 H-Bridge Input 2 for Left LC Shutter
LCRN O 6 H-Bridge Output for Right LC Shutter, "Negative" Terminal
LCRP O 5 H-Bridge Output for Right LC Shutter, "Positive" Terminal
LCLN O 4 H-Bridge Output for Left LC Shutter, "Negative" Terminal
LCLP O 3 H-Bridge Output for Left LC Shutter, "Positive" Terminal
Scaled Battery Voltage for MCU Comparator or ADC Input (Battery Voltage Monitoring)
COMP O 23
DO NOT CONNECT IF COMP FUNCTION IS NOT USED
SLEEP I/O 31 Sleep Enable Input from an MCU (edge triggered, only for system shutdown)
BST_EN I 1 Boost Enable Input from an MCU, High = Boost Enabled
CHG_EN I 30 Charger Enable Input from an MCU, High = Boost Enabled
I
2
C Clock Pin (only used for TI debug and test)
PSCL I/O 28
GROUND PIN IN APPLICATION
I
2
C Data Pin (only used for TI debug and test)
PSDA I/O 27
GROUND PIN IN APPLICATION
PGNDBST - 12 Boost Power Ground
AGND - 24 Analog Ground
DGND - 2 Digital Ground
MISC. AND PACKAGE
There is an internal electrical connection between the exposed thermal pad and the AGND ground
pin of the device. The thermal pad must be connected to the same potential as the AGND pin on
Thermal PAD - 33
the printed circuit board. Do not use the thermal pad as the primary ground input for the device.
AGND pin must be connected to ground at all times.
N/C - 14, 17 All N/C should be connected to the main system ground.
6 INTRODUCTION Copyright © 2011, Texas Instruments Incorporated
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