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Bill of Materials

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7 Bill of Materials

Table 2. HPA515B Bill of Materials

Count RefDes Value Description Size Part Number MFR

0 C1 open Capacitor, Ceramic, 35V, X5R, 10% 0603 GMK107BJ105K Taiyo Yuden

1 C10 2.2µF Capacitor, Ceramic, 6.3V, X5R, 10% 0805 GRM155R60J22ME15D Murata

1 C11 22µF Capacitor, Ceramic, 50V, COG, 5% 0603 GRM1885C1H220JA01D Murata

1 C2 1µF Capacitor, Ceramic, 35V, X5R, 10% 0603 GMK107BJ105K Taiyo Yuden

1 C3 1µF Capacitor, Ceramic, 6.3V, X5R, 10% 0603 JMK107BJ105KK-T Taiyo Yuden

1 C4 open Capacitor, Ceramic, 6.3V, X5R, 10% 0603 GRM188R60J475K Murata

2 C5, C8 4.7µF Capacitor, Ceramic, 6.3V, X5R, 10% 0603 GRM188R60J475K Murata

1 C6 10µF Capacitor, Ceramic, 6.3V, X5R, 20% 0603 GRM188R60J106ME47D Murata

0 C7 open Capacitor, Ceramic, 6.3V, X5R, 20% 0805 GRM188R60J106ME47D Murata

0 C9 open Capacitor, Ceramic, 6.3V, X7R, 10% 0805 GRM188R60J225KE19D Murata

1 D1 LTL29S Diode LED, red, 60 mW, 15mA 0603 LT L29S-N2Q1-25 Osram

1 D2 LSL29 Diode LED, green. 40 mW, 20mA 0603 LS L29K-G1H2-1 Osram

9 J1- J10 PTC36SAAN Header, Male 2-pin, 100mil spacing 0.100 inch x 2 PEC02SAAN Sullins

1 J12 PTC36SAAN Header, Male 6-pin, 100mil spacing 0.100 inch x 6 PEC06SAAN Sullins

1 J13 PTC36DAAN Connector, Male straight 2c5 pin, 100mil 0.100 inch x 5 2510-6002RB 3M

spacing, 4 wall X 2

2 J3, J11 PTC36SAAN Header, 3-pin, 100mil spacing 0.100 inch x 3 PEC03SAAN Sullins

2 JP1, JP2 PEC03SAAN Header, 2-pin, 100mil spacing 0.100 inch x 2 PEC02SAAN Sullins

2 JP3, JP4 PEC03SAAN Header, 3-pin, 100mil spacing 0.100 inch x 3 PEC03SAAN Sullins

1 L1 2.2µH Inductor, Power, xx A, yy milliohms 2.5 × 2.0 mm MIPSA2520D1R0 FDK

0 R1, R5, R13, open Resistor, Chip, 1/16W, 1% 0603 std std

R14, R20, R21

1 R10 open Resistor, Chip, 1/16W, 5% 0603 std std

2 R17, R18 3.3k Resistor, Chip, 1/16W, 5% 0603 std std

1 R2 10k Resistor, Chip, 1/16W, 1% 0603 std std

1 R3 1k Resistor, Chip, 1/16W, 1% 0603 std std

2 R4, R19 0 Resistor, Chip, 1/16W, 1% 0603 std std

5 R6, R11, R12, 100k Resistor, Chip, 1/16W, 1% 0603 std std

R15, R16

2 R7, R8 330k Resistor, Chip, 1/16W, 1% 0603 std std

1 R9 0 Resistor, Chip, 1/16W, 5% 0603 std std

1 S1 KT11P2JM Switch, SPST, PB Momentary, Sealed Tactile 0.245 X 0.251 KT11P2JM34LFS C & K

inch

1 U1 TPS65720YFF IC, PMU for Bluetooth Headsets DSBGA-25 TPS65720YFF TI

1 -- PCB, 2 In x 2 In x 0.062 In HPA515 Any

3 -- Shunt, 100-mil, Black 0.100 929950-00 3M

Notes 1. These assemblies are ESD sensitive, ESD precautions shall be observed.

2. These assemblies must be clean and free from flux and all contaminants.

Using unclean flux is unacceptable.

3. These assemblies must comply with workmanship standards IPC-A-610 Class 2.

4. Ref designators marked with an asterisk ('**') cannot be substituted.

All other components can be substituted with equivalent MFG's components.

5 Maximum 30 grams placement pressure on DSBGA-25 parts.

TPS65720EVM SLVU324–March 2010

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