Datasheet
TPS65708
SLVSAE1A –OCTOBER 2010– REVISED FEBRUARY 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
SIZE FOR WCSP PACKAGE PACKAGE
T
A
PART NO.
(1)
OPTIONS PACKAGE
VERSION CODE MARKING
VDCDC1 = 3.3V
VDCDC2 = 1.8V
VLDO1 = 2.8V
D = 2076 µm ±25 µm
–40°C to 85°C TPS65708 VLDO2 = 1.2V YZH WCSP TPS65708
E = 2076 µm ±25 µm
ISINK(PWM=1) = 7.5mA
SEQUENCING : DCDC1,
LDO1, DCDC2, LDO2
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder on ti.com, (http://www.ti.com)
ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range (unless otherwise noted).
(1)
VALUE UNIT
MIN MAX
all pins except A/PGND pins with respect to
–0.3 7 V
AGND
Voltage range
pin VLDO1 and VLDO2 with respect to AGND –0.3 3.6 V
L1, L2, VLDO1, VLDO2, PGND 700mA mA
Current AGND, ISINK 50mA mA
all other pins 3mA mA
Operating free-air temperature, T
A
–40 85 °C
Maximum junction temperature, T
J
125 °C
Storage temperature, T
ST
–65 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
TPS65708
THERMAL METRIC
(1)
UNITS
YZH (16 Pins)
θ
JA
Junction-to-ambient thermal resistance 75
θ
JCtop
Junction-to-case (top) thermal resistance 22
θ
JB
Junction-to-board thermal resistance 26
°C/W
ψ
JT
Junction-to-top characterization parameter 0.2
ψ
JB
Junction-to-board characterization parameter 24
θ
JCbot
Junction-to-case (bottom) thermal resistance N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2 Submit Documentation Feedback © 2010–2011, Texas Instruments Incorporated
Product Folder Link(s) :TPS65708