Datasheet

ABSOLUTE MAXIMUM RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
DISSIPATION RATINGS
TPS65563A
www.ti.com
......................................................................................................................................................... SLVS858A JULY 2008 REVISED AUGUST 2008
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
over operating free-air temperature range (unless otherwise noted)
UNIT
VCC, IGBT_VCC 0.6 to 6
Supply voltage range V
VBAT 0.6 to 13
V
o
Output voltage range of XFULL 0.6 to 6 V
V
SW
Switch terminal voltage range 0.6 to 50 V
I
SW
Switch current between SW and GND 3 A
V
I
Input voltage range CHG, I_PEAK, F_ON, F_EN 0.3 to V
CC
V
T
stg
Storage temperature range 40 to 150 ° C
T
J
Maximum junction temperature 125 ° C
ESD rating Human Body Model (HBM) JES22-A114 1.5 kV
(1) Stresses beyond those listed under " absolute maximum ratings " may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under " recommended operating
conditions " is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
MIN MAX UNIT
VCC, IGBT_VCC 2.7 5.5
Supply voltage V
VBAT 1.4 12
V
SW
Switch terminal voltage 0.3 45 V
I
SW
Switch current between SW and GND 2.3 A
V
IH
High-level digital input voltage at CHG, F_ON, and F_EN 2.0 V
V
IL
Low-level digital input voltage at CHG, F_ON, and F_EN 0.6 V
Operating free-air temperature 35 85 ° C
POWER RATINGS POWER RATINGS RATE
PACKAGE R
θ JA
(1)
T
A
< 25 ° C T
A
= 85 ° C
QFN 47.4 ° C/W 2.11 W 0.844 W
(1) The thermal resistance, R
θ JA
, is based on a soldered PowerPAD™ package on a 2S2P JEDEC board using thermal vias.
Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TPS65563A