Datasheet

TPS65250
SLVSAA3C JUNE 2010REVISED OCTOBER 2012
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TERMINAL FUNCTIONS (DCA) (continued)
NAME NO. I/O DESCRIPTION
GASP 31 O Open drain output to signal dying gasp operation to host (active low).
LDO
DG
32 O Dying gaps 18-V supply output. Decouple with a 10-µF, 25-V ceramic
capacitor.
VIN
DG
33 I Dying gasp circuit connection to input supply. Fit a 10-µF ceramic
capacitor close to this pin.
STRG 34 O Reservoir capacitor for dying gasps "storage and release" operation.
BST
DG
35 I Bootstrap capacitor for dying gasp circuit. Fit a ceramic capacitor from
this pin to the switching node of Buck 3.
LX3 36, 37 O Switching node for Buck 3
VIN3 38 Input supply for Buck 3. Fit a 10-µF ceramic capacitor close to this pin.
BST3 39 I Bootstrap capacitor for Buck 3. Fit a 47-nF ceramic capacitor from this pin
to the switching node.
EN3 40 I Enable pin for Buck 3. A low level signal on this pin disables it. If pin is
left open a weak internal pull-up to V3V will allow for automatic enable.
For a delayed start-up add a small ceramic capacitor from this pin to
ground.
PAD Power pad. Connect to ground.
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
Voltage range at STRG –0.3 to 30 V
Voltage range at VIN1,VIN2, VIN3, VINDG, LDODG, LX1, LX2, LX3 –0.3 to 18 V
Voltage range at LX1, LX2, LX3 (maximum withstand voltage transient < 10 ns) –1 to 18 V
Voltage at BST1, BST2, BST3, BSTDG, referenced to Lx pin –0.3 to 7 V
Voltage at V7V, COMP1, COMP2, COMP3 –0.3 to 7 V
Voltage at V3V, RLIM1, RLIM2, RLIM3, EN1,EN2,EN3, SS1, SS2,SS3, FB1, FB2, FB3,
–0.3 to 3.6 V
PGOOD, GASP, SYNC, ROSC, LOW_P
Voltage at AGND, GND –0.3 to 0.3 V
T
J
Operating virtual junction temperature range –40 to 125 °C
T
STG
Storage temperature range –55 to 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
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