Datasheet
16-Terminal TQFN PACKAGE
1516
L1
L1
1
2
VIN
OUTN
3
4
OUTN
VAUX
13
14
L2
L2
6
5
8
12
11
10
9
GND
FBG
FB
EN
PGND
OUTP
OUTP
PGND
Exposed
ThermalDie
RTEPackage
(TopView)
7
P0081-01
TPS65136
SLVS831A – APRIL 2008 – REVISED JULY 2008 .............................................................................................................................................................
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
(1)
T
A
OPTIONS ORDERING P/N PACKAGE PACKAGE MARKING
– 40 ° C to 85 ° C 4.6 V fixed
(2)
TPS65136RTE RTE CCO
(1) The RTE package is available in tape and reel. Add R suffix (TPS65136RTER) to order quantities of 3000 parts per reel. For the most
current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at
www.ti.com .
(2) Contact the factory for other output voltage options.
TERMINAL FUNCTIONS
TERMINAL
I/O DESCRIPTION
NAME NO.
EN 8 I Input pin to enable the device. Pulling this pin high enables the device. This pin has an internal 500-k Ω
pulldown resistor.
FB 7 I Feedback regulation input for the positive output voltage rail
FBG 6 I Feedback regulation input
GND 5 – Analog ground
L1 13, 14 I/O Inductor terminal
L2 15, 16 I/O Inductor terminal
OUTN 2, 3 O Negative output
OUTP 9, 10 O Positive output
PGND 11, 12 – Power GND
VAUX 4 O Reference voltage output. This pin requires a 100-nF capacitor for stability.
VIN 1 I Input supply
Exposed thermal die – Connect this pad to analog GND.
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Product Folder Link(s): TPS65136