Datasheet

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DESCRIPTION (CONTINUED)
ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS TABLE
(1)
TPS65130, TPS65131
SLVS493B – MARCH 2004 – REVISED SEPTEMBER 2004
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
The converter operates with a fixed frequency PWM control topology and, if power-save mode is enabled, it uses
a pulse-skipping mode at light load currents. It operates with only 500-µA device quiescent current. Independent
enable pins allow power up and power down sequencing for both outputs. The device has an internal current
limit overvoltage protection and a thermal shutdown for highest reliability under fault conditions.
ORDERING INFORMATION
T
A
SWITCH CURRENT LIMIT PART NUMBER
(1)
BOOST CONVERTER INVERTING CON-
VERTER
–40 ° C to 85 ° C 800 mA 800 mA TPS65130RGE
–40 ° C to 85 ° C 1950 mA 1950 mA TPS65131RGE
(1) The RGE package is availabletaped and reeled. Add an R suffix to the device type (i.e.,
TPS65130RGER) toorder quantities of 3000 devices per reel. It is also available in minireels. Add a T
suffix to the device type (i.e., TPS65130RGET) toorder quantities of 250 devices per reel.
over operating free-air temperature range unless otherwise noted
(1)
TPS65130/1
VIN, INN Input voltage range at pins
(2)
–0.3 V to +6.0 V
VPOS Maximum voltage at pin
(2)
17 V
VNEG Minimum voltage at pin
(2)
–17 V
Voltage at pins ENN, ENP, FBP, FBN, CN, CP, PSP, PSN, BSW
(2)
–0.3 V to V
IN
+ 0.3 V
INP Input voltage at pin
(2)
17 V
Differential voltage between pins OUTN to V
INN
(2)
24 V
T
J
Operating virtual junction temperature –40 ° C to 150 ° C
T
STG
Storage temperature range –65 ° C to 150 ° C
(1) Stresses beyond those listedunder "absolute maximum ratings” may cause permanent damage to thedevice. These are stress ratings
only, and functional operation of the deviceat these or any other conditions beyond those indicated under "recommendedoperating
conditions” is not implied. Exposure to absolute-maximum-ratedconditions for extended periods may affect device reliability.
(2) All voltage values are withrespect to network ground terminal, unless otherwisenoted.
DERATING FACTOR T
A
= 70 ° C T
A
= 85 ° C
T
A
≤ 25 ° C
PACKAGE Θ
JA
Θ
JB
Θ
JC
ABOVE T
A
= 25 ° C POWER RATING POWER
POWER RATING
RATING
RGE 37.8 ° C/W 27.8 ° C/W 57.9 ° C/W 2646 mW 26 mW/ ° C 1455 mW 1058 mW
(1) This thermal data is based on assembly of the device on a JEDEC high K board. The PowerPAD must be soldered on a pad on the
board. There must be vias within the pad that contact the ground plane in the PCB. Exceeding the maximum junctiontemperature will
force the device into thermalshutdown.
2