Datasheet

TPS65100-Q1
www.ti.com
SLVS849A JULY 2008REVISED APRIL 2012
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
Voltage range on pin VIN
(2)
–0.3 V to 6 V
Voltage range on pins V
O
1, SUP, PG
(2)
–0.3 V to 15.5 V
Voltage range on pins EN, MODE, ENR
(2)
–0.3 V to V
I
+ 0.3 V
Voltage on pin VCOMIN 14 V
Voltage on pin SW
(2)
20 V
Continuous power dissipation See Dissipation Ratings Table
Operating junction temperature range –40°C to 150°C
Storage temperature range –65°C to 150°C
Lead temperature (soldering, 10 seconds) 260°C
Human-Body Model (HBM) 2000 V
Electrostatic discharge (ESD) rating Machine Model (MM) 100 V
Charged-Device Model (CDM) 1000 V
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
DISSIPATION RATINGS
T
A
25°C T
A
= 70°C T
A
= 85°C
PACKAGE Rθ
JA
POWER RATING POWER RATING POWER RATING
24-pin TSSOP 30.13°C/W (PWP soldered) 3.3 W 1.83 W 1.32 W
THERMAL INFORMATION
TPS65100-Q1
THERMAL METRIC
(1)
UNIT
PWP (24 PINS)
θ
JA
Junction-to-ambient thermal resistance 37.2
θ
JCtop
Junction-to-case (top) thermal resistance 19.5
θ
JB
Junction-to-board thermal resistance 16.7
°C/W
ψ
JT
Junction-to-top characterization parameter 0.4
ψ
JB
Junction-to-board characterization parameter 16.6
θ
JCbot
Junction-to-case (bottom) thermal resistance 2.1
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
MIN TYP MAX UNIT
VIN Input voltage 2.7 5.8 V
L Inductor
(1)
4.7 μH
T
A
Operating free-air temperature –40 125 °C
T
J
Operating virtual-junction temperature –40 125 °C
(1) See the Application Information section for further information.
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