Datasheet
TPS65023, TPS65023B
SLVS670J –JUNE 2006– REVISED SEPTEMBER 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
(1)
T
A
PACKAGE PART NUMBER
(2)
–40°C to 85°C 40 pin QFN (RSB) TPS65023RSB
–40°C to 85°C 40 pin QFN (RSB) TPS65023BRSB
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) The RSB package is available in tape and reel. Add the R suffix (TPS65023RSBR, TPS65023BRSBR) to order quantities of 3000 parts
per reel. Add the T suffix (TPS65023RSBT; TPS65023BRSBT) to order quantities of 250 parts per reel.
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
MIN MAX
V
I
Input voltage range on all pins except AGND and PGND pins with respect to –0.3 7 V
AGND
Current at VINDCDC1, L1, PGND1, VINDCDC2, L2, PGND2, VINDCDC3, L3, 2000 mA
PGND3
Peak current at all other pins 1000 mA
Continuous total power dissipation See Thermal Information Table
T
A
Operating free-air temperature –40 85 °C
T
J
Maximum junction temperature 125 °C
T
s
Storage temperature –65 150 °C
tg
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability
THERMAL INFORMATION
TPS65023
THERMAL METRIC
(1)
RSB UNITS
40 PINS
θ
JA
Junction-to-ambient thermal resistance 32.7
θ
JCtop
Junction-to-case (top) thermal resistance 15.3
θ
JB
Junction-to-board thermal resistance 13.6
°C/W
ψ
JT
Junction-to-top characterization parameter 0.1
ψ
JB
Junction-to-board characterization parameter 5.4
θ
JCbot
Junction-to-case (bottom) thermal resistance 1.1
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2 Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated
Product Folder Link(s) :TPS65023 TPS65023B