Datasheet
TPS65022
SLVS667A –JULY 2006– REVISED SEPTEMBER 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
T
A
PACKAGE
(1)
PART NUMBER
(2)
–40°C to 85°C 40 pin QFN (RHA) TPS65022RHA
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) The RHA package is available in tape and reel. Add the R suffix (TPS65022RHAR) to order quantities of 2500 parts per reel. Add the T
suffix (TPS65022RHAT) to order quantities of 250 parts per reel.
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
V
I
Input voltage range on all pins except AGND and PGND pins with respect to AGND –0.3 to 7 V
Current at VINDCDC1, L1, PGND1, VINDCDC2, L2, PGND2, VINDCDC3, L3, PGND3 2000 mA
Peak current at all other pins 1000 mA
Continuous total power dissipation See the Thermal Information Table
T
A
Operating free-air temperature –40 to 85 °C
T
J
Maximum junction temperature 125 °C
T
stg
Storage temperature –65 to 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability
THERMAL INFORMATION
TPS65022
THERMAL METRIC
(1)
UNITS
RHA (40-PINS)
θ
JA
Junction-to-ambient thermal resistance 31.6
θ
JCtop
Junction-to-case (top) thermal resistance 18.2
θ
JB
Junction-to-board thermal resistance 6.6
°C/W
ψ
JT
Junction-to-top characterization parameter 0.2
ψ
JB
Junction-to-board characterization parameter 6.5
θ
JCbot
Junction-to-case (bottom) thermal resistance 1.7
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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