Datasheet
www.ti.com
ABSOLUTE MAXIMUM RATINGS
PACKAGE DISSIPATION RATINGS
(1)
TPS65013
SLVS517A – AUGUST 2004 – REVISED JANUARY 2005
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
The serial interface can be used for dynamic voltage scaling, for collecting information on and controlling the
battery charger status, for optionally controlling 2 LED driver outputs, a vibrator driver, masking interrupts, or for
disabling/enabling and setting the LDO output voltages. The interface is compatible with the fast/standard mode
I
2
C™ specification allowing transfers at up to 400 kHz.
ORDERING INFORMATION
T
A
PACKAGE PART NUMBER
(1)
-40 ° C to 85 ° C 7 mm × 7 mm, 48-pin QFN TPS65013RGZ
(1) The RGZ package is available in tape and reel. Add R suffix (TPS65013RGZR) to order quantities of
2500 parts per reel. Add T suffix (TPS65013RGZT) to order quantities of 250 parts per reel.
over operating free-air temperature range unless otherwise noted
(1)
UNIT
Input voltage on VAC pin with respect to AGND 20 V
Input voltage range on all other pins except AGND/PGND pins with respect to AGND -0.3 V to 7 V
HBM and CDM capabilities at pins VIB, PG, and LED2 1 kV
Current at AC, VBAT, VINMAIN, L1, PGND1 1800 mA
Peak current at all other pins 1000 mA
Continuous power dissipation See Dissipation Rating Table
Operating free-air temperature, T
A
-40 ° C to 85 ° C
Maximum junction temperature, T
J
125 ° C
Storage temperature, T
stg
-65 ° C to 150 ° C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
AMBIENT MAX POWER DISSIPATION DERATING FACTOR
TEMPERATURE FOR T
j
= 125 ° C
(2)
ABOVE T
A
= 55 ° C
25 ° C 3 W
30 mW/ ° C
55 ° C 2.1 W
(1) The TPS65013 is housed in a 48-pin QFN package with exposed leadframe on the underside. This 7
mm × 7 mm package exhibits a thermal impedance (junction-to-ambient) of 33 K/W when mounted
on a JEDEC high-k board.
(2) Consideration needs to be given to the maximum charge current when the assembled application
board exhibits a thermal impedance which differs significantly from the JEDEC high-k board.
2