Datasheet

TPS63700
SLVS530C –SEPTEMBER 2005–REVISED JUNE 2013 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
T
A
SWITCH CURRENT LIMIT PACKAGE TYPE SYMBOL PART NUMBER
(2)
–40°C to 85°C 1000 mA SON-10 NUB TPS63700DRC
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) The DRC package is available taped and reeled. Add an R suffix to the device type (i.e., TPS63700DRCR) to order quantities of 3000
devices per reel. Add a T suffix to the device type (i.e., TPS63700DRCT) to order quantities of 250 devices peer reel.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
TPS63700
Input voltage range at VIN
(2)
–0.3 V to +6.0 V
Input voltage range at IN
(2)
VIN
Minimum voltage at VOUT
(2)
–18 V
Voltage at EN, FB, COMP, PS
(2)
–0.3 V to V
IN
+ 0.3 V
Differential voltage between OUT to V
IN
(2)
24 V
Operating virtual junction temperature, T
J
–40°C to 150°C
Storage temperature range, T
STG
–65°C to 150°C
(1) Stresses beyond those listed under "absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal, unless otherwise noted.
THERMAL INFORMATION
TPS63700
THERMAL METRIC
(1)
UNITS
DRC 10 PINS
θ
JA
Junction-to-ambient thermal resistance 41.2
θ
JC(TOP)
Junction-to-case(top) thermal resistance 62.8
θ
JB
Junction-to-board thermal resistance 16.6
°C/W
ψ
JT
Junction-to-top characterization parameter 1.2
ψ
JB
Junction-to-board characterization parameter 16.8
θ
JC(BOTTOM)
Junction-to-case(bottom) thermal resistance 4.1
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
Input voltage range, V
I
2.7 5.5 V
Operating free-air temperature range, T
A
–40 85 °C
Operating virtual junction temperature range, T
J
–40 125 °C
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