Datasheet

P
DMAX
+
T
JMAX
* T
A
R
qJA
TPS63700
SLVS530C –SEPTEMBER 2005–REVISED JUNE 2013 www.ti.com
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues, such as thermal coupling, airflow, added
heatsinks and convection surfaces, and the presence of heat-generating components affect the power-
dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are:
• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB
• Introducing airflow to the system
The maximum recommended junction temperature (T
J
) of the TPS63700 device is 125°C. The thermal resistance
of the 10-pin SON, 3 × 3-mm package (DRC) is R
JA
= 48.7°C/W. Specified regulator operation is ensured to a
maximum ambient temperature T
A
of 85°C. Therefore, the maximum power dissipation is about 821 mW. More
power can be dissipated if the maximum ambient temperature of the application is lower.
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