Datasheet

GND
V
IN
V
OUT
Enable
Currentselect
C
OUT
C
IN
L1
R1
R2
R3
R4
C3
TPS62750, TPS62751
www.ti.com ................................................................................................................................................. SLVS955A –JULY 2009–REVISED SEPTEMBER 2009
LAYOUT CONSIDERATIONS
As for all switching power supplies, the layout is an important step in the design. Proper function of the device
demands careful attention to PCB layout. Care must be taken in board layout to get the specified performance. If
the layout is not carefully done, the regulator could show poor line and/or load regulation, stability issues as well
as EMI problems. It is critical to provide a low inductance, impedance ground path. Therefore, use wide and
short traces for the main current paths. The input capacitor should be placed as close as possible to the IC pins
as well as the inductor and output capacitor.
Connect the GND Pin of the device to the Power Pad of the PCB and use this Pad as a star point. Use a
common Power GND node and a different node for the Signal GND to minimize the effects of ground noise.
Connect these ground nodes together to the Power Pad (star point) underneath the IC. Keep the common path
to the GND PIN, which returns the small signal components and the high current of the output capacitors as
short as possible to avoid ground noise. The FB line should be connected right to the output capacitor and routed
away from noisy components and traces (e.g., SW line).
Figure 28. Suggested Layout
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