Datasheet

G001
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Oscilloscope Traces (taken on the TPS62730EVM-726)
5.3 Bill of Materials
Table 2. HPA726 Bill of Materials
COUNT RefDes Value Description Size Part Number MFR
-001 -002
2 2 C1, C2 2.2 µF Capacitor, Ceramic, 6.3V, X5R, 20% 0402 GRM155R60J225ME15D muRata
0 0 C4 Open Capacitor, Ceramic, 6.3V, X5R, 20% 0603 Std Std
1 1 C3 22 µF Capacitor, Ceramic, 16V, X5R, 20% 1206 GRM31CR61C226ME15L muRata
1 1 L1 2.2 µH Inductor, SMT, 0.8A, 0.23 ohm 0805 LQM21PN2R2NGC MuRata
1 1 R1 10 kΩ Resistor, Chip, 1/16W, 1% 0603 Std Std
1 1 R2 1 MΩ Resistor, Chip, 1/16W, 1% 0603 Std Std
1 0 U1 TPS62730DRY IC, Step Down Converter with Bypass 1,5 mm × 1 mm TPS62730DRY TI
Mode for Low Power Wireless, 2.1V
Output
0 1 U1 TPS62733DRY IC, Step Down Converter with Bypass 1,5 mm × 1 mm TPS62733DRY TI
Mode for Low Power Wireless, 2.3V
Output
6 Oscilloscope Traces (taken on the TPS62730EVM-726)
Figure 6. CH1: Phase; CH2: Output Ripple, Vin = 3.3 V, and 21-Ω Load
7
SLVU455AApril 2011Revised August 2012 TPS62730, TPS62733 Stepdown Converters With Bypass Mode for Ultralow-
Power Wireless Applications
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