Datasheet

TPS62732, TPS62733
TPS62730
SLVSAC3C –MAY 2011–REVISED DECEMBER 2012 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
Automatic Bypass Mode Transition
Thresholds V
IT BYP
PACKAGE
PART
T
A
OUTPUT VOLTAGE [V] ORDERING
(1)
NUMBER
MARKING
V
IT BYP
[V] V
IT BYP
[V] V
IT BYP
[mV]
rising V
IN
falling V
IN
hysteresis
TPS62730 2.10 2.25 2.20 50 TPS62730DRY RP
TPS62731
(2)
2.05 2.2 2.15 50 TPS62731DRY RQ
TPS62732 1.90 2.10 2.05 50 TPS62732DRY RR
–40°C to
85°C
TPS62733 2.3 2.48 2.41 70 TPS62733DRY YA
TPS62734
(2)
2.10 2.28 2.23 50 TPS62734DRY SL
TPS62735
(2)
2.10 2.33 2.23 100 TPS62735DRY SM
(1) The DRY package is available in tape on reel. See section package option addendum for package quantities.
(2) Device status is product preview, contact TI for more details / samples
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Voltage range
(2)
VIN, SW, VOUT –0.3 4.2 V
ON/BYP, STAT –0.3 V
IN
+0.3, ≤4.2 V
Temperature range Operating junction temperature, T
J
–40 125 °C
Storage, T
stg
–65 150 °C
ESD rating
(3)
Human Body Model - (HBM) 2 kV
Machine Model (MM) 150 V
Charge Device Model - (CDM) 1 kV
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network ground terminal.
(3) ESD testing is performed according to the respective JESD22 JEDEC standard.
THERMAL INFORMATION
THERMAL METRIC
(1)
DRY / 6 PINS UNITS
θ
JA
Junction-to-ambient thermal resistance 293.8
θ
JCtop
Junction-to-case (top) thermal resistance 165.1
θ
JB
Junction-to-board thermal resistance 160.8
°C/W
ψ
JT
Junction-to-top characterization parameter 27.3
ψ
JB
Junction-to-board characterization parameter 159.6
θ
JCbot
Junction-to-case (bottom) thermal resistance 65.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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Product Folder Links: TPS62732 TPS62733 TPS62730