Datasheet

TPS62620, TPS62621
TPS62622, TPS62623
TPS62624, TPS62625
SLVS848C –JULY 2009– REVISED AUGUST 2011 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
PACKAGE
PART OUTPUT DEVICE
T
A
ORDERING
(2) (3)
MARKING
NUMBER VOLTAGE SPECIFIC FEATURE
CHIP CODE
TPS62620YFF GF
TPS62620 1.82V
TPS62620YFD GE
TPS62621 1.8V TPS62621YFF GH
TPS62622 1.5V TPS62622YFF GV
-40°C to 85°C
TPS62623YFF GZ
TPS62623 1.225V
TPS62623YFD K3
TPS62624 1.2V Output capacitor discharge TPS62624YFF GX
TPS62625 1.2V TPS62625YFF KC
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) The YFF package is available in tape and reel. Add a R suffix (e.g. TPS62620YFFR) to order quantities of 3000 parts. Add a T suffix
(e.g. TPS62620YFFT) to order quantities of 250 parts.
(3) Internal tap points are available to facilitate output voltages in 25mV increments.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
UNIT
Voltage at VIN, SW
(2)
-0.3 V to 7 V
V
I
Voltage at FB
(2)
-0.3 V to 3.6 V
Voltage at EN, MODE
(2)
-0.3 V to V
I
+ 0.3 V
Power dissipation Internally limited
T
A
Operating temperature range
(3)
-40°C to 85°C
T
J
(max) Maximum operating junction temperature 150°C
T
stg
Storage temperature range -65°C to 150°C
Human body model 2 kV
ESD rating
(4)
Charge device model 1 kV
Machine model 200 V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T
A(max)
) is dependent on the maximum operating junction temperature (T
J(max)
), the
maximum power dissipation of the device in the application (P
D(max)
), and the junction-to-ambient thermal resistance of the part/package
in the application (θ
JA
), as given by the following equation: T
A(max)
= T
J(max)
–(θ
JA
X P
D(max)
). To achieve optimum performance, it is
recommended to operate the device with a maximum junction temperature of 105°C.
(4) The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. The machine model is a 200-pF
capacitor discharged directly into each pin.
DISSIPATION RATINGS
(1)
POWER RATING DERATING FACTOR
PACKAGE R
θJA
(2)
R
θJB
(2)
T
A
≤ 25°C ABOVE T
A
= 25°C
YFF-6 125°C/W 53°C/W 800mW 8mW/°C
(1) Maximum power dissipation is a function of T
J
(max), θ
JA
and T
A
. The maximum allowable power dissipation at any allowable ambient
temperature is P
D
= [T
J
(max)-T
A
] / θ
JA
.
(2) This thermal data is measured with high-K board (4 layers board according to JESD51-7 JEDEC standard).
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