Datasheet
TPS62360, TPS62361B
TPS62362, TPS62363
www.ti.com
SLVSAU9C –MAY 2011–REVISED NOVEMBER 2012
THERMAL INFORMATION
TPS6236x
THERMAL METRIC
(1)
YZH UNITS
16 PINS
θ
JA
Junction-to-ambient thermal resistance
(2)
94.8
θ
JCtop
Junction-to-case (top) thermal resistance
(3)
25
θ
JB
Junction-to-board thermal resistance
(4)
60
°C/W
ψ
JT
Junction-to-top characterization parameter
(5)
3.2
ψ
JB
Junction-to-board characterization parameter
(6)
57
θ
JCbot
Junction-to-case (bottom) thermal resistance
(7)
n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψ
JT
, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ
JA
, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψ
JB
, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ
JA
, using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
RECOMMENDED OPERATING CONDITIONS
MIN TYP MAX UNIT
V
IN
Input voltage range, V
IN
I
OUT
≤ 2.5A 2.5 5.5 V
I
OUT
> 2.5A 3 5.5 V
I
OUT,avg
Continuous output current
(1)
2.5 A
t
rf
Rising and falling signal transition time at EN, VSELx 30 mV/µs
T
A
Operating ambient temperature
(2)
–40 85 °C
T
J
Operating junction temperature –40 125 °C
(1) The TPS6236x device is designed to provide 3A according to typical application processor load profiles. Drawing more than 2.5A
permanently might impact the device life time. See THERMAL AND DEVICE LIFE TIME INFORMATION for details.
(2) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature [T
A(max)
] is dependent on the maximum operating junction temperature [T
J(max)
], the
maximum power dissipation of the device in the application [P
D(max)
], and the junction-to-ambient thermal resistance of the part/package
in the application (θ
JA
), as given by the following equation: T
A(max)
= T
J(max)
– (θ
JA
× P
D(max)
)
ELECTRICAL CHARACTERISTICS
Unless otherwise noted the specification applies for VIN = 3.6V over an operating ambient temp. –40°C ≤ T
A
≤ 85°C; Circuit
of Parameter Measurement Information section (unless otherwise noted). Typical values are for T
A
= 25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INPUT
V
IN
Input voltage range at VIN, AVIN 2.5 5.5 V
V
DD
I
2
C and registers supply voltage range 1.15 3.6 V
I
SD(AVIN)
Shutdown current into AVIN EN = LOW, V
DD
= 0V 0.65 5 µA
T
A
= 25°C 0.5 1 µA
EN = LOW,
I
SD(VIN)
Shutdown current into VIN
V
DD
= 0V
T
A
= 85°C 1 3 µA
I
SD(VDD)
Shutdown current into VDD EN = LOW, I
2
C bus idle 0.01 µA
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