Datasheet

www.ti.com
GND
C
OUT
C
I
N
V
OUT
V
IN
U
L
GND
R1
R2
C1
TPS62290 , TPS62291 , TPS62293
SLVS764C – JUNE 2007 – REVISED MARCH 2008
common Power GND node and a different node for the Signal GND to minimize the effects of ground noise.
Connect these ground nodes together to the Power Pad (star point) underneath the IC. Keep the common path
to the GND PIN, which returns the small signal components and the high current of the output capacitors as
short as possible to avoid ground noise. The FB line should be connected right to the output capacitor and routed
away from noisy components and traces (e.g., SW line).
Figure 24. Layout
Copyright © 2007 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Link(s): TPS62290 TPS62291 TPS62293