Datasheet

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5.3 Bill of Materials
Board Layout, Schematic, and Bill of Materials
Table 1 presents the bill of materials for the TPS622X0EVM-229 evaluation module.
Table 1. TPS622x0EVM-229 Bill of Materials
Count
RefDes Value Description Size Part Number Mfr
-001 -002
C1, C3, C4,
4 4 10 μ F Capacitor, Ceramic, 6.3V, X5R, 20% 0603 GRM188R60J106ME47D Murata
C6
2 0 33 pF Capacitor, Ceramic, 50V, C0G, 5% 0603 C1608C0G1H330J TDK
C2, C5
0 2 22 pF Capacitor, Ceramic, 50V, C0G, 5% 0603 C1608C0G1H220J TDK
8 8 J1-J8 Header, 2 pin, 100mil spacing (36-pin strip) 1.100x2 PTC36SAAN Sullins
3 3 JP1-JP3 Header, 3 pin, 100mil spacing (36-pin strip) 1.100x3 PTC36SAAN Sullins
FDK
1 0 2.2 μ H Inductor, SMT Multilayer, 1.3A, 80m Ω 2520 mm MIPF2520D2R2
Corp.
L1
FDK
0 1 2.2 μ H Inductor, SMT Multilayer, 1.2A, 110m Ω 2520 mm MIPS2520D2R2
Corp.
0.118 x Coilcraf
1 1 L2 2.2 μ H Inductor, SMT, 1.5A, 110m Ω LPS3015-222ML
0.118 t
3 3 R1, R3, R4 365 k Ω Resistor, Chip, 1/16W, 1% 0603 Std Std
1 1 R2 182 k Ω Resistor, Chip, 1/16W, 1% 0603 Std Std
SON-6
1 0 IC, 2.25MHz 300mA Step-down Converter TPS62240DRV TI
(DRV)
U1
SON-6
0 1 IC, 2.25MHz 600mA Step-down Converter TPS62260DRV TI
(DRV)
1 0 IC, 2.25MHz 300mA Step-down Converter SOT23-5 TPS62240DDC TI
U2
0 1 IC, 2.25MHz 600mA Step-down Converter SOT23-5 TPS62260DDC TI
1 1 - PCB, 2.1 In x 1.4 In x 0.062 In HPA229 Any
3 3 - Shunt, 100mil, Black 0.100 929950-00
TPS622x0EVM-229 12 SLVU216 – July 2007
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