Datasheet

Exposed
Thermal Pad
1
2
3
4
5
10
9
8
7
6
PGND
VIN
EN
NC
FB
VOS
SW
SLEEP
PG
AGND
TPS62175, TPS62177
www.ti.com SLVSB35B –OCTOBER 2012–REVISED JANUARY 2014
DEVICE INFORMATION
DQC PACKAGE
(TOP VIEW)
spacingspacing
TERMINAL FUNCTIONS
PIN
(1)
I/O DESCRIPTION
NAME NO.
PGND 1 Power ground connection.
VIN 2 I Supply voltage for the converter.
EN 3 I Enable input (High=Enabled, Low= Disabled)
NC 4 This pin is recommended to be connected to AGND but can left be floating.
Voltage feedback of adjustable version. Connect resistive divider to this pin. It is recommended to
FB 5 I
connect FB to AGND for fixed voltage versions for improved thermal performance.
AGND 6 Analog ground connection.
PG 7 O Output power good. (open drain, requires pull-up resistor)
Sleep mode input (High=Normal Operation, Low=Sleep mode Operation). Can be operated
SLEEP 8 I
dynamically during operation. If Sleep mode is not used, connect to VOUT.
Switch node, connected to the internal MOSFET switches. Connect inductor between SW and
SW 9 O
output capacitor.
VOS 10 I Output voltage sense pin and connection for the control loop circuitry.
Exposed Must be connected to AGND and PGND. Must be soldered to achieve appropriate power dissipation
Thermal Pad and mechanical reliability.
(1) For more information about connecting pins, see DETAILED DESCRIPTION and APPLICATION INFORMATION sections.
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