Datasheet

TPS62175, TPS62177
www.ti.com SLVSB35B –OCTOBER 2012–REVISED JANUARY 2014
THERMAL INFORMATION
The TPS62175/7 is designed for a maximum operating junction temperature (T
j
) of 125°C. Therefore the
maximum output power is limited by the power losses. Since the thermal resistance of the package is given, the
size of the surrounding copper area and a proper thermal connection of the IC can reduce the thermal
resistance. To get an improved thermal behavior, it's recommended to use top layer metal to connect the device
with wide and thick metal lines (see Figure 55 above). Internal ground layers can connect to vias directly under
the IC for improved thermal performance.
For more details on how to use the thermal parameters, see the application notes: Thermal Characteristics
Application Note (SZZA017), and (SPRA953).
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