Datasheet

8
PG
SW
VOS
FB
Exposed
Thermal
Pad
PGND
VIN
EN
AGND
7
6
5
2
3
1
4
TPS62170, TPS62171
TPS62172, TPS62173
SLVSAT8C –NOVEMBER 2011–REVISED SEPTEMBER 2013 www.ti.com
DEVICE INFORMATION
DSG PACKAGE
(TOP VIEW)
Terminal Functions
PIN
(1)
I/O DESCRIPTION
NAME NO.
PGND 1 Power ground
VIN 2 I Supply voltage
EN 3 I Enable input (High = enabled, Low = disabled)
AGND 4 Analog Ground
FB 5 I Voltage feedback of adjustable version. Connect resistive voltage divider to this pin. It is recommended to
connect FB to AGND on fixed output voltage versions for improved thermal performance.
VOS 6 I Output voltage sense pin and connection for the control loop circuitry.
Switch node, which is connected to the internal MOSFET switches. Connect inductor between SW and
SW 7 O
output capacitor.
PG 8 O Output power good (High = VOUT ready, Low = VOUT below nominal regulation) ; open drain (requires
pull-up resistor; goes high impedance, when device is switched off)
Exposed Must be connected to AGND. Must be soldered to achieve appropriate power dissipation and mechanical
Thermal Pad reliability.
(1) For more information about connecting pins, see DETAILED DESCRIPTION and APPLICATION INFORMATION sections.
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