Datasheet

TPS62170, TPS62171
TPS62172, TPS62173
www.ti.com SLVSAT8C –NOVEMBER 2011–REVISED SEPTEMBER 2013
The TPS6217X is designed for a maximum operating junction temperature (T
j
) of 125°C. Therefore the maximum
output power is limited by the power losses that can be dissipated over the actual thermal resistance, given by
the package and the surrounding PCB structures. If the thermal resistance of the package is given, the size of
the surrounding copper area and a proper thermal connection of the IC can reduce the thermal resistance. To
get an improved thermal behavior, it's recommended to use top layer metal to connect the device with wide and
thick metal lines. Internal ground layers can connect to vias directly under the IC for improved thermal
performance.
If short circuit or overload conditions are present, the device is protected by limiting internal power dissipation.
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Product Folder Links: TPS62170 TPS62171 TPS62172 TPS62173