Datasheet

TPS62170, TPS62171
TPS62172, TPS62173
SLVSAT8C NOVEMBER 2011REVISED SEPTEMBER 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
(1)
T
A
OUTPUT VOLTAGE PART NUMBER
(2)
PACKAGE ORDERING PACKAGE MARKING
adjustable TPS62170 TPS62170DSG QUE
1.8 V TPS62171 TPS62171DSG QUF
-40°C to 85°C 8-Pin WSON
3.3 V TPS62172 TPS62172DSG QUG
5.0 V TPS62173 TPS62173DSG QUH
(1) For detailed ordering information please check the PACKAGE OPTION ADDENDUM section at the end of this datasheet.
(2) Contact the factory to check availability of other fixed output voltage versions.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE UNIT
VIN –0.3 to 20
V
EN –0.3 to V
IN
+0.3
Pin Voltage
Range
(2)
SW -0.3 to V
IN
+0.3 V
FB, PG, VOS –0.3 to 7 V
Power Good sink
PG 10 mA
current
Operating junction temperature range, T
J
–40 to 125
Temperature range °C
Storage temperature range, T
stg
–65 to 150
HBM Human body model 2 kV
ESD rating
(3)
CDM Charge device model 0.5 kV
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
(2) All voltages are with respect to network ground terminal.
(3) ESD testing is performed according to the respective JESD22 JEDEC standard.
THERMAL INFORMATION
TPS6217X
THERMAL METRIC
(1)
UNITS
DSG (8) PINS
θ
JA
Junction-to-ambient thermal resistance 61.8
θ
JC(TOP)
Junction-to-case(top) thermal resistance 61.3
θ
JB
Junction-to-board thermal resistance 15.5
°C/W
ψ
JT
Junction-to-top characterization parameter 0.4
ψ
JB
Junction-to-board characterization parameter 15.4
θ
JC(BOTTOM)
Junction-to-case(bottom) thermal resistance 8.6
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN TYP MAX UNIT
Supply Voltage, V
IN
3 17 V
Operating free air temperature, T
A
–40 85 °C
Operating junction temperature, T
J
–40 125 °C
2 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated
Product Folder Links: TPS62170 TPS62171 TPS62172 TPS62173