Datasheet
1
2
3
4
8
7
6
5
PGND
VIN
EN
AGND
PG
SW
VOS
FB
8
PG
SW
VOS
FB
Exposed
Thermal
Pad
PGND
VIN
EN
AGND
7
6
5
2
3
1
4
TPS62160
TPS62161, TPS62162, TPS62163
SLVSAM2C –NOVEMBER 2011–REVISED SEPTEMBER 2013
www.ti.com
DEVICE INFORMATION
DSG PACKAGE
(TOP VIEW)
DGK PACKAGE
(TOP VIEW)
spacing
Terminal Functions
PIN
(1)
I/O DESCRIPTION
NAME NO.
PGND 1 Power ground
VIN 2 I Supply voltage
EN 3 I Enable input (High = enabled, Low = disabled)
AGND 4 Analog Ground
FB 5 I Voltage feedback of adjustable version. Connect resistive voltage divider to this pin. It is recommended to
connect FB to AGND on fixed output voltage versions for improved thermal performance.
VOS 6 I Output voltage sense pin and connection for the control loop circuitry.
Switch node, which is connected to the internal MOSFET switches. Connect inductor between SW and
SW 7 O
output capacitor.
PG 8 O Output power good (High = VOUT ready, Low = VOUT below nominal regulation) ; open drain (requires
pull-up resistor; goes high impedance, when device is switched off)
Exposed Must be connected to AGND. Must be soldered to achieve appropriate power dissipation and mechanical
Thermal Pad
(2)
reliability.
(1) For more information about connecting pins, see DETAILED DESCRIPTION and APPLICATION INFORMATION sections.
(2) The exposed thermal pad is available with the DSG package only, not with DGK package.
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Product Folder Links: TPS62160 TPS62161 TPS62162 TPS62163