Datasheet

VIN
VIN
PGND
L
COUT
CIN
R1
R2
VOUT
AGND
TPS62160
TPS62161, TPS62162, TPS62163
SLVSAM2C NOVEMBER 2011REVISED SEPTEMBER 2013
www.ti.com
In summary, the input capacitor should be placed as close as possible to the VIN and PGND pin of the IC. This
connections should be done with wide and short traces. The output capacitor should be placed such that its
ground is as close as possible to the IC's PGND pins - avoiding additional voltage drop in traces. This connection
should also be made short and wide. The inductor should be placed close to the SW pin and connect directly to
the output capacitor - minimizing the loop area between the SW pin, inductor, output capacitor and PGND pin.
The feedback resistors, R
1
and R
2
, should be placed close to the IC and connect directly to the AGND and FB
pins. Those connections (including VOUT) to the resistors and even more to the VOS pin should stay away from
noise sources, such as the inductor. The VOS pin should connect in the shortest way to VOUT at the output
capacitor, while the VOUT connection to the feedback divider can connect at the load.
A single point grounding scheme should be implemented with all grounds (AGND, PGND and the thermal pad)
connecting at the IC's exposed thermal pad. See Figure 33 for the recommended layout of the TPS6216X. More
detailed information can be found in the EVM Users Guide, SLVU483.
The Exposed Thermal Pad must be soldered to the circuit board for mechanical reliability and to achieve
appropriate power dissipation. Although the Exposed Thermal Pad can be connected to a floating circuit board
trace, the device will have better thermal performance if it is connected to a larger ground plane. The Exposed
Thermal Pad is electrically connected to AGND.
Figure 33. Layout Example
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-
dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below:
Improving the power dissipation capability of the PCB design
Improving the thermal coupling of the component to the PCB by soldering the Exposed Thermal Pad
Introducing airflow in the system
For more details on how to use the thermal parameters, see the application notes: Thermal Characteristics
Application Note (SZZA017), and (SPRA953).
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Product Folder Links: TPS62160 TPS62161 TPS62162 TPS62163