Datasheet
TPS62160
TPS62161, TPS62162, TPS62163
SLVSAM2C –NOVEMBER 2011–REVISED SEPTEMBER 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
(1)
PACKAGE
T
A
OUTPUT VOLTAGE PART NUMBER
(2)
PACKAGE ORDERING
MARKING
adjustable TPS62160 TPS62160DSG QTV
1.8 V TPS62161 TPS62161DSG QUB
8-Pin WSON
-40°C to 85°C 3.3 V TPS62162 TPS62162DSG QUC
5.0 V TPS62163 TPS62163DSG QUD
adjustable TPS62160 8-Pin MSOP TPS62160DGK 62160
(1) For detailed ordering information please check the PACKAGE OPTION ADDENDUM section at the end of this datasheet.
(2) Contact the factory to check availability of other fixed output voltage versions.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE UNIT
VIN –0.3 to 20 V
Pin voltage range
(2)
EN, SW –0.3 to V
IN
+0.3 V
FB, PG, VOS –0.3 to 7 V
Power Good sink current PG 10 mA
Operating junction temperature range, T
J
–40 to 125
Temperature range °C
Storage temperature range, T
stg
–65 to 150
HBM Human body model 2 kV
ESD rating
(3)
CDM Charge device model 0.5 kV
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
(2) All voltages are with respect to network ground terminal.
(3) ESD testing is performed according to the respective JESD22 JEDEC standard.
THERMAL INFORMATION
TPS6216X
THERMAL METRIC
(1)
UNITS
DSG (8) DGK (8)
PINS PINS
θ
JA
Junction-to-ambient thermal resistance 61.8 184.3
θ
JC(TOP)
Junction-to-case(top) thermal resistance 61.3 74.6
θ
JB
Junction-to-board thermal resistance 15.5 105.8
°C/W
ψ
JT
Junction-to-top characterization parameter 0.4 13.3
ψ
JB
Junction-to-board characterization parameter 15.4 104.2
θ
JC(BOTTOM)
Junction-to-case(bottom) thermal resistance 8.6 -
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN TYP MAX UNIT
Supply Voltage, V
IN
3 17 V
Operating free air temperature, T
A
–40 85 °C
Operating junction temperature, T
J
–40 125 °C
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Product Folder Links: TPS62160 TPS62161 TPS62162 TPS62163