Datasheet

1
2
3
4
16151413
12
11
10
9
7 6 5
L1
CIN
R1R2
COUT
VOUT
GND
GND
AVIN
8
EN
PG
to
AGND
PVIN
to GND
plane
C
TPS62150, TPS62150A
TPS62151, TPS62152, TPS62153
SLVSAL5B –NOVEMBER 2011–REVISED JUNE 2013 www.ti.com
Figure 39. Layout Example
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-
dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below:
• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB by soldering the Exposed Thermal Pad
• Introducing airflow in the system
For more details on how to use the thermal parameters, see the application notes: Thermal Characteristics
Application Note (SZZA017), and (SPRA953).
The TPS6215X is designed for a maximum operating junction temperature (T
j
) of 125°C. Therefore the maximum
output power is limited by the power losses that can be dissipated over the actual thermal resistance, given by
the package and the surrounding PCB structures. If the thermal resistance of the package is given, the size of
the surrounding copper area and a proper thermal connection of the IC can reduce the thermal resistance. To
get an improved thermal behavior, it's recommended to use top layer metal to connect the device with wide and
thick metal lines. Internal ground layers can connect to vias directly under the IC for improved thermal
performance.
If short circuit or overload conditions are present, the device is protected by limiting internal power dissipation.
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Product Folder Links: TPS62150, TPS62150A TPS62151 TPS62152 TPS62153