Datasheet
TPS62125
SLVSAQ5C –MARCH 2012–REVISED DECEMBER 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
TA PART NUMBER
(1)
V
OUT
PACKAGE MARKING
TPS62125 adjustable SAQ
–40°C to 85°C
TPS62126
(2)
1.8V TBD
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com
(2) samples available, contact TI for further information
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
MIN MAX
VIN - 0.3 20 V
SW - 0.3 20 V
EN - 0.3 V
IN
+0.3V V
Pin voltage range
(2)
FB – 0.3 3.6 V
VOS, PG - 0.3 12 V
EN_hys – 0.3 7 V
Power Good sink I
PG
10 mA
current
EN_hys sink current I
EN_hys
3
HBM Human body model 2
kV
ESD rating
(3)
CDM Charge device model 1
Machine model 100 V
Maximum operating junction temperature, T
J
–40 125 °C
Storage temperature range, T
stg
–65 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal GND.
(3) The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. The machine model is a 200-pF
capacitor discharged directly into each pin.
THERMAL INFORMATION
TPS62125
THERMAL METRIC
(1)
DSG UNITS
8 PINS
θ
JA
Junction-to-ambient thermal resistance 65.2
θ
JC(top)
Junction-to-case(top) thermal resistance 93.3
θ
JB
Junction-to-board thermal resistance 30.1
°C/W
ψ
JT
Junction-to-top characterization parameter 0.5
ψ
JB
Junction-to-board characterization parameter 47.4
θ
JC(bottom)
Junction-to-case(bottom) thermal resistance 7.2
(1) For more information about traditional and new thermal metrics, see the IC PackageThermal Metrics application report, SPRA953
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