Datasheet

TPS62082
1µH
10µF
3.6V .. 6V
V
IN
22µF
180k
V
OUT
POWER GOOD
3.3V
SW
VOS
VIN
EN
GND
MODE
PG
FB
L
C
IN
C
OUT
R
2
R
1
V
IN
V
OUT
GND
1
TPS62080, TPS62080A
TPS62081, TPS62082
www.ti.com SLVSAE8D –SEPTEMBER 2011–REVISED JULY 2013
Figure 32. PCB Layout Suggestion
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-
dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below:
• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB by soldering the ThermalPAD™
• Introducing airflow in the system
For more details on how to use the thermal parameters, see the application notes: Thermal Characteristics
Application Notes SZZA017 and SPRA953.
APPLICATION EXAMPLES
Figure 33. 3.3V Fixed Output Voltage Application (TPS62082)
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Product Folder Links: TPS62080 TPS62080A TPS62081 TPS62082