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TPS62060EVM Assembly Drawings and Layout

8 TPS62060EVM Assembly Drawings and Layout

Figure 17 through Figure 21 show the design of the TPS62060EVM-663 printed-circuit board. This EVM

has been designed using a four-layer, 1-ounce, copper-clad PCB (1.8 in.by 1.5 in.) with all components in

an active area on the top side of the board. All active traces are routed on the top and bottom layers to

allow the user to easily view, probe, and evaluate the TPS62060 control integrated circuit (IC) in a

practical, double-sided application environment. Moving components to both sides of the PCB or using

additional internal layers can offer additional size reduction for space-constrained systems.

NOTE: Board layouts are not to scale. These figures are intended to show how the board is laid

out; they are not intended to be used for manufacturing TPS62060EVM-663 PCBs.

Figure 17. TPS62060EVM Component Placement, Top View

SLVU396–September 2010 TPS62060EVM-663

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