Datasheet

V
IN
V
OUT
GND
GND
C1
C2
R1
R2
R3
L1
EN
TPS61260, TPS61261
SLVSA99A –MAY 2011–REVISED FEBRUARY 2013 www.ti.com
Figure 20. PCB Layout Suggestion
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-
dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB by soldering the Exposed Thermal Pad
• Introducing airflow in the system
For more details on how to use the thermal parameters in the dissipation ratings table, please check the Thermal
Characteristics Application Note (SZZA017) and the IC Package Thermal Metrics Application Note (SPRA953).
APPLICATION EXAMPLE AS LED DRIVER
Figure 21 shows the TPS61261 configured to drive an LED with analog and/or PWM dimming. This circuit does
not require an external current sensing resistor and so provides high efficiency, as shown in Figure 22. See
SLVA562 for details. This design is available as the TPS61261EVM-208.
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